Silicone Free Heat Sink Compound
Applied under power transistors and other heat generating devices, compound assists in transferring heat to metal chassis or heat sink for dissipation. Product will not harden, dry out, melt or contaminate wave solder baths.- Functional Temparature Range -40°F to 392°F (-40°C to 200°C)
- Silicone Free
- Will not Migrate
- Will not Harden
- Conducts Heat
- Easy Application
